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NXP Semiconductors
LPC1111/12/13/14
Table 1.
Ordering information …continued
Type number
Package
Name
Description
Version
LPC1114FHN33/201
HVQFN33
HVQFN: plastic thermal enhanced very thin quad flat package; no
n/a
leads; 33 terminals; body 7 x 7 x 0.85 mm
LPC1114FHN33/301
HVQFN33
HVQFN: plastic thermal enhanced very thin quad flat package; no
n/a
leads; 33 terminals; body 7 x 7 x 0.85 mm
LPC1113FBD48/301
LPC1114FBD48/301
LQFP48
LQFP48
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x sot313-2
1.4 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x sot313-2
1.4 mm
LPC1114FA44/301
PLCC44
PLCC44; plastic leaded chip carrier; 44 leads
sot187-2
4.1 Ordering options
Table 2.
Ordering options
Type number
Flash
Total
UART
I 2 C/
SPI
ADC
Package
SRAM
RS-485
Fast+
channels
LPC1111
LPC1111FHN33/101
LPC1111FHN33/201
8 kB
8 kB
2 kB
4 kB
1
1
1
1
1
1
8
8
HVQFN33
HVQFN33
LPC1112
LPC1112FHN33/101
LPC1112FHN33/201
16 kB
16 kB
2 kB
4 kB
1
1
1
1
1
1
8
8
HVQFN33
HVQFN33
LPC1113
LPC1113FHN33/201
LPC1113FHN33/301
LPC1113FBD48/301
24 kB
24 kB
24 kB
4 kB
8 kB
8 kB
1
1
1
1
1
1
1
1
2
8
8
8
HVQFN33
HVQFN33
LQFP48
LPC1114
LPC1114FHN33/201
LPC1114FHN33/301
LPC1114FBD48/301
LPC1114FA44/301
32 kB
32 kB
32 kB
32 kB
4 kB
8 kB
8 kB
8 kB
1
1
1
1
1
1
1
1
1
1
2
2
8
8
8
8
HVQFN33
HVQFN33
LQFP48
PLCC44
LPC1111_12_13_14_0
? NXP B.V. 2009. All rights reserved.
Objective data sheet
Rev. 00.11 — 13 November 2009
3 of 53
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